Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it.Ĭhip-size package (CSP) developed by National Semiconductor īare die supplied without a package. Variation of WLCSP, for power devices like MOSFETs. Package size is no more than 1.2× the size of the silicon chip Ī WL-CSP or WLCSP package is just a bare die with a redistribution layer (or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a BGA package. Acronymīare silicon chip, an early chip-scale package
A SOT-23 device is shown (top) for comparison. Very-very-thin small-outline no-lead packageĮxample WL-CSP devices sitting on the face of a U.S. Very-thin shrink small-outline package Īlso referred as MSOP = micro small-outline package Thermally-enhanced thin shrink small-outline package Thermally-enhanced shrink small-outline package IC packaged in transparent packaging used in optical sensor Heat-sink very-thin quad flat-pack, no-leads No-leads, with exposed die-pad for heatsinking Īlso called as micro lead frame ( MLF). Micro surface-mount device extended technology Ĭhip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame.Įarliest version metal/ceramic packaging with flat leads Ī package with metric pin distribution (0.5–0.8 mm pitch) Non-standard DIP with smaller 0.07 in (1.78 mm) pin spacing.
Like DIP but with staggered (zig-zag) pins. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips. 13.4 Packages with more than six terminals.13.1.5 Metal electrode leadless face (MELF).9 Transistor, diode, small-pin-count IC packages.Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. In flip chip systems the IC is connected by solder bumps to a substrate. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Other types are proprietary designations that may be made by only one or two manufacturers.
Smd components size pro#
Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. A very large number of different types of package exist. Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.
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